http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101189460-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-77 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-9607 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-3244 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-76 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B35-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B35-64 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B35-62645 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01G25-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B35-622 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B35-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B35-50 |
| filingDate | 2011-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2012-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2012-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101189460-B1 |
| titleOfInvention | Low thermal conductivity composite oxide for high temperature environment heat shielding and its manufacturing method |
| abstract | In the present invention, it is represented by A 2 B 2 O 7- (C, D) O 2 in a pyrochlore-fluorite double structure, wherein A is La 1-x Gd x (0.0 <x <0.5) , B is Zr, C is La 1-y Gd y (0.5 <y <1.0), and D is Zr relates to a low thermal conductivity composite oxide for high temperature environment heat shielding and a method of manufacturing the same. According to the present invention, by having a pyrochlore-fluorite dual structure, it is possible to maximize the phonon scattering effect associated with thermal conductivity and to suppress the grain growth when exposed to high temperatures It can provide a foundation and have a binary system of microstructure, so that the formation of line defects and the synergy of the thermal barrier effect due to the coexistence of two materials with different thermal conductivity characteristics can be expected. In addition, the low thermal conductivity of 2.0 W / mK or less can be realized in the ultra high temperature region of 1100 ℃ or higher, and thus it can be utilized as a heat shielding material for improving the durability of components in high temperature environment. |
| priorityDate | 2011-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.