http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101188169-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-304 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-35 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J175-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-20481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K13-046 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K13-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J175-04 |
| filingDate | 2010-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2012-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2012-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101188169-B1 |
| titleOfInvention | Adhesive composition with improved heat resistance and adhesive sheet for attaching flexible circuit board reinforcement plate using same |
| abstract | The present invention relates to an adhesive composition having improved heat resistance and an adhesive sheet for attaching a flexible circuit board reinforcement plate using the same. The adhesive composition of the present invention is a polyurethane urea resin (A), an epoxy curing agent (B) prepared by the reaction of a urethane-based prepolymer having an isocyanate end group and an amine compound, more preferably a monoamine or diamine compound having a high reaction rate, and As a phenol curing agent (C) is contained, an adhesive sheet for attaching a flexible circuit board reinforcement plate or a heat sink using the adhesive composition may be provided. The adhesive sheet of the present invention maintains long-term storage like an acrylic adhesive under soaking conditions, has excellent adhesion with a flexible circuit board reinforcement plate, and improves solder heat resistance to cope with lead-free solder reflow process temperatures. |
| priorityDate | 2010-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 45.