| abstract |
The first semiconductor chip 21 is arranged on the chip mounting member 11, and the bonding wire 36 connected to the electrode pad 21e of the first semiconductor chip 21 is attached to the first insulating adhesive 31. It is covered and fixed. The second semiconductor chip (22) is laminated on the first semiconductor chip (21) via a first insulating adhesive (31). As a result, when the chips are stacked and mounted, a defect in which the bonding wires of the chips immediately above the substrate are disconnected or shorted can be prevented.n n n n Semiconductor chip, bonding wire, lead frame, insulating adhesive, electrode pad |