http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101182249-B1
Outgoing Links
Predicate | Object |
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classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0397 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0392 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-075 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0043 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039 |
filingDate | 2008-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2012-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2012-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-101182249-B1 |
titleOfInvention | Positive photosensitive resin composition |
abstract | The present invention relates to a positive photosensitive resin composition, wherein the positive photosensitive resin composition includes (A) a repeating unit represented by the following Formula 1A or includes a repeating unit of the following Formulas 1A and 1B, and includes at least one Polybenzoxazole precursor having an organic group including an alkenyl-based or (meth) acrylic functional group at its terminal portion; (B) a photosensitive diazoquinone compound; (C) silane compound; (D) dissolution modifiers; (E) the compound represented by the following formula (2) or (3) or a mixture thereof; And (F) a solvent.n n n [Formula 1A]n n n n n n n n [Formula 1B]n n n n n n n n [Formula 2]n n n n n n n n (3)n n n n n n n n (In the formulas 1A, 1B, 2, and 3, the definition of each substituent is the same as defined in the specification.)n n n The positive photosensitive resin composition of the present invention has an improved crosslinking effect during thermosetting, which is excellent in thermal, mechanical and electrical properties as a semiconductor protective film, and exhibits high sensitivity and high resolution, good pattern shape, and excellent residue removal property. Can be.n n n n Positive type, photosensitive polybenzoxazole precursor composition, dissolution regulator, thermal polymerization crosslinking agent, aqueous alkali solution, semiconductor device |
priorityDate | 2008-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 370.