http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101174979-B1
Outgoing Links
Predicate | Object |
---|---|
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-2227 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L75-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-49 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-49 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L75-04 |
filingDate | 2010-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2012-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2012-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-101174979-B1 |
titleOfInvention | Curable resin composition, dry film and printed wiring board using the same |
abstract | The present invention is a curable resin composition containing a halogen-free flame retardant, a curable resin composition capable of forming a solder resist layer excellent in flame retardancy, low deformation, and insulation reliability, a dry film thereof, and flame retardant curing such as a solder resist by these. Provided is a printed wiring board on which a film is formed. Curable resin composition contains (A) carboxyl group-containing resin, (B) phosphorus containing compound, and (C) layered double hydroxide. In addition to each of the above components, by containing a thermosetting component having two or more cyclic ether groups and / or cyclic thioether groups in the molecule (D), a thermosetting resin composition can be obtained, and further (F) photopolymerization initiator and (G) By containing a photopolymerizable monomer, it can be set as the photocurable thermosetting resin composition. Preferably, it further contains (E) aluminum hydroxide. |
priorityDate | 2009-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 553.