http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101174978-B1
Outgoing Links
Predicate | Object |
---|---|
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-49 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L75-04 |
filingDate | 2010-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2012-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2012-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-101174978-B1 |
titleOfInvention | Curable resin composition, and dry film and printed wiring board using the same |
abstract | The present invention is a curable resin composition containing a halogen-free colorant and a flame retardant, the curable resin composition having low deformation and capable of forming a solder resist layer excellent in concealability of poor appearance resulting from discoloration by oxidation of a copper circuit, It provides the dry wiring and the printed wiring board by which the flame-retardant hardening film, such as a soldering resist, is formed by these. Curable resin composition contains (A) carboxyl group-containing resin, (B) titanium oxide, and (C) aluminum hydroxide. In addition to each of the above components, by containing a thermosetting component having two or more cyclic ether groups and / or cyclic thioether groups in the molecule (D), a thermosetting resin composition can be obtained, and further (F) photopolymerization initiator and (G) By containing a photopolymerizable monomer, it can be set as the photocurable thermosetting resin composition. Preferably, it further contains (E) phosphorus containing compound. |
priorityDate | 2009-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 549.