| abstract |
Provided is a low-cost semiconductor device capable of stacking a quality-guaranteed (tested) commercially available chip size package and having a low coplanarity value and excellent mounting reliability. A flexible circuit board is bonded to at least a portion of the semiconductor package side surface, and the flexible circuit board positioned on the solder ball mounting surface side of the semiconductor package is bent in a region that is inside the outer end of the semiconductor package. An apparatus and its manufacturing method.n n n n Semiconductor devices |