http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101169033-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12041 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-58 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-00 |
| filingDate | 2010-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2012-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2012-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101169033-B1 |
| titleOfInvention | Transparent silicone composition for bonding optical semiconductor chips |
| abstract | The present invention (a) a silicone resin comprising a Q-unit, an M-unit and a D-unit in a unit molecule, and optionally comprising a T-unit; (b) a solid silicone resin comprising an alkenyl group bonded to at least two silicon atoms in a unit molecule; (c) a curing agent comprising at least two hydrogens bonded to silicon atoms; (d) addition reaction catalysts; And (e) an alcohol comprising a carbon-carbon triple bond, and relates to a transparent silicone composition for adhering an optical semiconductor chip, wherein the coefficient of linear expansion has a value of 100-250 ppm / K. The composition of the present invention can be applied for optical semiconductor chip adhesion requiring adhesiveness, transparency and heat resistance, and is suitable for dispensing and stamping methods in an optical semiconductor packaging process and a thixotropic index (TI) Coefficient) value. The composition of the present invention has strong mechanical properties, low coefficient of linear expansion and high adhesive strength by using the silicone resin (a) as a main material without using a filler. As a result, the composition of the present invention is suitable as a chip adhesive because of high adhesive stress and surface curing degree, and simultaneously exhibits the function as a transparent material for enhancing light extraction efficiency from the device, and the light transmittance is maintained even after long-term heat exposure and ultraviolet irradiation. Discoloration does not occur even under the action of moisture. |
| priorityDate | 2010-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 77.