http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101162584-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_dba908dcbd2a3fe85ca12b2d9ef6217e http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e0c805f34f25850faf0258cf1bba4ae6 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R43-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-40 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R43-00 |
| filingDate | 2012-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2012-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_72399450e7062333f01a326f6361e7c2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d9cddcb9ecb1246db4c337a31d90a768 |
| publicationDate | 2012-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101162584-B1 |
| titleOfInvention | Surface treatment method of communication connector |
| abstract | The present invention relates to a surface treatment method of a communication and wireless communication connector, comprising the steps of: a) plating a copper plated underlayer on a surface of a communication connector, b) plating a tin plated underlayer on a surface of a communication connector; c) plating a silver plated underlayer on the surface of the communication connector; d) plating a tin-nickel alloy containing 62 to 75 wt.% tin and 25 to 38 wt.% tin on top of the underlayer. 62 to 75 wt.% Of a plated copper base layer and a tin base layer on the surface of the communication connector, and a tin plated layer on top of each base layer, including forming a surface plating layer, A communication connector is prepared that includes a surface plating layer that is a tin-nickel alloy layer containing 25 to 38 wt.% Nickel. The present invention provides a plating layer having a relatively low cost excellent corrosion resistance and PIMD characteristics by plating with a tin-nickel alloy on top of each base layer, thereby preventing performance degradation of the communication connector and reducing manufacturing costs. It can work. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101770687-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102395583-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101494136-B1 |
| priorityDate | 2012-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 49.