http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101155360-B1

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filingDate 2008-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2012-06-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2012-06-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101155360-B1
titleOfInvention Printed Board Terminals
abstract 2 to 12% by mass of Zn and 0.1 to 1.0% by mass of Sn, and if necessary, at least one of Ni, Mg, Fe, P, Mn, Co, Be, Ti, Cr, Zr, Al and Ag It contains 0.005-0.5 mass% in total, the balance consists of copper and its unavoidable impurities, has a thermal conductivity of 150-260 W / (m? K) and a micro-Vickers hardness of 120-215, and the surface has an average thickness. The thickness (t) of the board | substrate mounting part obtained by press-processing the Sn plating copper alloy material covered with the pure Sn phase of 0.1-2.0 micrometers, and this alloy material is 0.2-1.0 mm, and the width (w) of the board | substrate mounting part is Sn-plated copper alloy material that is excellent in mountability even after plating before pressing by a printed circuit board terminal having a solder-like property with a pin-shaped member of 0.9 t to 2.0 tmm and having a copper alloy base material exposed on the press wave surface, And a printed board terminal processed from this material. .
priorityDate 2007-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 30.