http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101140790-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-385 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78 |
| filingDate | 2010-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2012-05-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2012-05-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101140790-B1 |
| titleOfInvention | Acrylic adhesive composition for wafer dicing and dicing tape comprising the same |
| abstract | The present invention relates to an acrylic adhesive composition for wafer dicing and a dicing tape including the same, and more particularly, to a photocurable acrylic adhesive including a photocurable acrylic oligomer and an acrylic adhesive having excellent ultraviolet curing properties, a curing agent, and a photoinitiator. An acrylic pressure sensitive adhesive composition for wafer dicing, wherein the acrylic pressure sensitive adhesive composition for wafer dicing fundamentally solves problems such as transfer problems and chipping phenomena that may occur during a dicing process by adjusting the adhesive force before and after ultraviolet irradiation to provide a semiconductor chip. There is an advantage that it can be usefully used as an adhesive tape for fixing a wafer dicing for fixing a shake or the like. |
| priorityDate | 2010-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 66.