http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101137757-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15788 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-42 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-42 |
| filingDate | 2009-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2012-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2012-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101137757-B1 |
| titleOfInvention | Formation method of protruding electrode and substitution gold plating solution |
| abstract | (Problem) Provided is a method of forming a low cost and simplified projection electrode, and a substituted gold plating solution used therein.n n n (Method) According to the method of forming the bump 2 according to the present invention, the surface of the conductive core 21 formed on the electrode 12 is coated with a substituted gold plating solution containing potassium sulfite and polyethyleneimine or a derivative thereof. In the one coating process, a gold film 22 having a thickness of 0.1 µm or more and 0.5 µm or less is formed on the surface of the core 21. Thereby, since the gold film 22 of film thickness sufficient to form the bump 2 is formed, it is not necessary to carry out coating process repeatedly. As a result, the manufacturing process can be simplified and the cost can be reduced.n n n n Protrusion electrode, substitution gold plating solution |
| priorityDate | 2008-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 40.