http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101134588-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D1-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D1-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D1-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1454 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 |
| filingDate | 2005-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2012-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2012-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101134588-B1 |
| titleOfInvention | Chemical mechanical polishing composition for metal wiring |
| abstract | FIELD OF THE INVENTION The present invention relates to chemical mechanical polishing (CMP) compositions for the flattening of metal interconnects, comprising a nonionic and / or cationic surfactant as an amine complexing agent and a corrosion inhibitor. The polishing composition of the present invention maintains a neutral to weak alkaline pH range, and forms a soft metal complex film on the metal surface to effectively control corrosion and etching of the metal and to maintain an excellent polishing rate. It can be usefully used in the chemical mechanical polishing process for flattening. |
| priorityDate | 2005-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 79.