http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101132568-B1

Outgoing Links

Predicate Object
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31116
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-762
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-76
filingDate 2010-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2012-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2012-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101132568-B1
titleOfInvention How to form a pattern without generating fumes
abstract The present invention provides a method for forming a pattern without fume generated by a time delay between processes when dry cleaning is applied after pattern formation in manufacturing a fine semiconductor device. In one configuration of the pattern forming method according to the present invention, forming a pattern by etching a material layer using an etching gas containing a halogen compound, and the remaining hydrogen of the etching gas remaining in the pattern activated hydrogen atoms And removing using at least one of water vapor.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020235823-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102178593-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019032282-A1
priorityDate 2010-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20060020977-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100606532-B1
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419512635
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http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458392451

Total number of triples: 25.