| abstract |
The present invention provides an alkaline composition useful in the microelectronics industry for stripping or cleaning semiconductor wafer substrates by removing photoresist residues and other unwanted contaminants. The composition comprises (a) at least one base, (b) at least one metal corrosion inhibiting metal halide of formula W z MX y , wherein M is Si, Ge, Sn, Pt, P, B, Au, Ir, Os , Cr, Ti, Zr, Rh, Ru and Sb are metals selected from the group; X is a halide selected from F, Cl, Br and I; W is H, an alkali metal or an alkaline earth metal, and a metal-free ion hydroxide Seed base residues; y is a number from 4 to 6 depending on the metal halide; z is 1,2 or 3).n n n Semiconductor wafer substrates, stripping, cleaning, alkaline compositions, bases, metal corrosion inhibiting metal halides |