http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101124546-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85439 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01012 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48639 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01028 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49582 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25F5-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-46 |
| filingDate | 2004-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2012-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2012-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101124546-B1 |
| titleOfInvention | Electrolytic Peeling Method |
| abstract | This invention is a copper plating film exposed from the silver plating film which partially covers the copper plating film formed in the whole surface of a member; And an electrolytic peeling method of electrolytically peeling leaking silver thinner than the silver plating film formed on the exposed portion of the copper plating film by using the copper plating film as an anode, wherein the electrolytic peeling is cyan-based. The compound is carried out using a copper-free electrolytic stripping solution, wherein the electrolytic stripping solution comprises a compound capable of forming a complex ion of silver which is more easily dissociated than the complex ion of silver and cyan; An electrolytic peeling method in which silver and copper are precipitated on a negative electrode which is used as a counter electrode to the positive electrode and which is chemically stable to the electrolytic stripping solution.n n n n Electrolytic peeling liquid, lead frame, silver plating film, copper plating film |
| priorityDate | 2003-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 72.