http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101123006-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01J37-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1607 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01J23-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01J20-262 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L31-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L23-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 |
| filingDate | 2007-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2012-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2012-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101123006-B1 |
| titleOfInvention | Resin composition for catalyst adsorption of electromagnetic wave shielding layer, metal pattern formation method using same and metal pattern manufactured accordingly |
| abstract | In the electromagnetic wave shielding pattern formation comprising a acrylate copolymer resin consisting of a maleimide monomer used to form a metal pattern for electromagnetic wave shield and an acrylate having a carboxyl group, and a method for forming a metal pattern using the same a) copolymer adsorption comprising a copolymer resin of a monomer having a carboxyl group and a maleimide monomer having an oil-soluble functional group in nitrogen, (b) a polyfunctional monomer having an ethylenically unsaturated bond, (c) a photoinitiator and (d) an organic solvent Resin compositions; And (a) forming a pattern for adsorbing a metal catalyst on the substrate with the resin composition; (b) a metal catalyst adsorption step of adsorbing metal ions on the formed pattern for adsorbing the metal catalyst; (c) reducing the metal catalyst; And (d) electroless plating the reduced metal catalyst layer. The metal pattern forming method of the present invention may not use the base film, which is an expensive raw material, and the manufacturing cost of the copper mesh pattern is reduced, the price is competitive, and since there is no etching process, it is possible to implement a fine microcircuit, Moire) is reduced.n n n n Electromagnetic shielding, metal micropattern formation, metal ion adsorption, monomers having carboxylic acid functional groups, maleimide monomers having fat soluble functional groups in nitrogen |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210084219-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102404028-B1 |
| priorityDate | 2007-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 239.