| abstract |
A method of forming a through electrode is disclosed. The through electrode includes a columnar electrode filling the through hole, a lower electrode pad formed on the lower side of the columnar electrode and having an area larger than the cross section of the through hole, and an upper end formed on the upper side of the columnar electrode and having an area larger than the cross section of the through hole. The electrode pad is integrally provided. The lower electrode pad is arranged to seal the lower opening of the through hole. The columnar electrode fills the through hole by laminating copper on the lower electrode pad.n n n n Through electrode, through hole, columnar electrode, lower electrode pad, upper electrode pad |