| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24994
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31511 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-5033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D405-14 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D405-14 |
| filingDate |
2004-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2012-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2012-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101117063-B1 |
| titleOfInvention |
Epoxy Compounds and Cured Epoxy Resin Products |
| abstract |
The present invention provides a novel epoxy compound that can be converted into a cured epoxy resin product having liquid crystal properties by curing with a curing agent. Since the cured epoxy resin product of the present invention exhibits excellent thermal conductivity, it is also useful as a heat insulating material requiring high heat release properties such as a printed circuit board. |
| priorityDate |
2003-06-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |