| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12514
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-1089
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12507
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12493 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76874
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-584
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1879
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-165 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-34 |
| filingDate |
2008-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2012-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2012-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101110447-B1 |
| titleOfInvention |
Plating material in which a metal thin film was formed by electroless plating and a manufacturing method thereof |
| abstract |
A plating material having a seed layer formed with a thin and uniform film thickness capable of forming ultra fine wiring by electroless plating, and further eliminating the trouble of forming two layers of a barrier layer and a catalyst metal layer prior to the formation of the seed layer. Plating material which can be made, and the method of manufacturing the plating material.n n n On the substrate, an alloy thin film of a metal (A) having a catalytic activity of electroless plating, a metal ion contained in the electroless plating solution, and a metal (B) capable of substitution plating is formed, on which an electroless A plating material in which a metal thin film is formed by substitution and reduction plating, wherein an alloy thin film of the catalytically active metal (A) and the substitution-platable metal (B) contains the metal (A) at least 5 atomic% and at most 40 atomic atoms. A plating material having a composition of% or less, wherein the metal thin film formed by the electroless substitution and reduction plating is a metal thin film having a thickness of 10 nm or less and a resistivity of 10 μΩ · cm or less. It is preferable that the said metal (B) has a barrier function with respect to the metal of a metal thin film. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101817930-B1 |
| priorityDate |
2007-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |