| abstract |
The present invention is to provide a flip chip mounting method and a bump forming method with high productivity and reliability applicable to flip chip mounting of next generation LSI.n n n The resin 14 containing the solder powder 16 and the bubble generator is supplied to the gap between the circuit board 21 having the plurality of connection terminals 11 and the semiconductor chip 20 having the plurality of electrode terminals 12. After that, the resin 14 is heated to generate bubbles 30 from the bubble generator contained in the resin 14. The resin 14 is pushed out of the bubble as the generated bubble 30 grows, and self-assembles between the connection terminal 11 and the electrode terminal 12. Further, the resin 14 is heated to melt the solder powder 16 contained in the resin 14 self-assembled between the terminals, thereby forming the terminal-to-terminal connecting body 22 and completing the flip chip mounting body.n n n n Flip chip mounting body, connector, self-assembly, bubble generator, solder powder |