| abstract |
The present invention provides a polishing pad for chemical mechanical polishing comprising a body, a polishing surface, and a plurality of elongated pores, wherein at least 10% of the elongated pores have an aspect ratio of at least 2: 1 in the direction of the same plane as the polishing surface. Substantially oriented. The invention further includes a method of polishing a substrate.n n n n Chemical mechanical polishing, aspect ratio, oriented pore, polishing pad |