| abstract |
The semiconductor device 51 is provided. The device 51 is a redistribution conductor 59 having a die 53 having a connection pad 61 thereon, a base portion 64 and a lateral extension 63 electrically connected to the connection pad 61. ), A bump connecting portion 65 electrically connected to the redistribution conductor 59, and a passivation layer 57 disposed between the lateral extension 63 of the redistribution conductor 59 and the die 53. Preferably, the redistribution conductor 59 is convoluted and can shift relative to the passivation layer 57 and base 64 to relieve mechanical stress between the substrate 69 and the die 53 when under sufficient stress. To be separated from or passivated from the passivation layer 57. The bump and coil redistribution conductor 59, which accepts strain due to small CTE differences without malfunction, makes the DCA flip-chip reliable without underfill or additional assembly processes.n n n n Lateral extension, bump connection, redistribution conductor, passivation layer, die |