http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101101207-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F3-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1445 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1454 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 |
| filingDate | 2009-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2012-01-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2012-01-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101101207-B1 |
| titleOfInvention | CPM Composition for Metal Film Polishing |
| abstract | The present invention relates to a slurry composition for polishing a metal film for chemical mechanical polishing in a semiconductor manufacturing process. The slurry composition according to the present invention comprises a core made of spherical organic particles having an average particle diameter of 10 to 1000 nm, and a surface of 1 It relates to a metal film polishing slurry composition comprising 0.0001 to 20% by weight of the core-shell particles coated in the form of an inorganic oxide film having a thickness of ~ 100nm.n n n The slurry according to the present invention exhibits a high polishing rate even at low pressure due to the inorganic oxide coated on the surface using an organic compound coated with an inorganic oxide film, and mechanical impact caused by the inorganic oxide due to the softness of the organic particles. By buffering the scratches are less likely to occur on the surface as well as has the advantage of reducing the dishing effect. The metal film polishing slurry composition of the present invention is useful as a metal film polishing slurry containing copper.n n n n Chemical mechanical polishing, inorganic oxides, organic compounds, slurries |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101465762-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101465761-B1 |
| priorityDate | 2009-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 76.