| abstract |
An electrolyte composition for depositing a tin alloy on a substrate is disclosed. The electrolyte composition comprises additives selected from tin ions, ions of one or more alloy metals, acids, thiourea derivatives, and alkanol amines, polyethylene imines, alkoxylated aromatic alcohols, and combinations thereof. Also disclosed are methods of depositing a tin alloy on a substrate and forming interconnect bumps on a semiconductor device. |