| abstract |
A microelectronic assembly comprising two elements and a method of forming such an assembly are provided. The microelectronic element includes a major surface, a dielectric layer exposed on the major surface, and one or more bond pads. The microelectronic element can include a number of active circuit elements. A first metal layer is deposited over the one or more bond pads and the dielectric layer. A second element is provided on which the second metal layer is deposited, and the first metal layer is bonded with the second metal layer. The microelectronic assembly is divided into individual units, each containing a chip, along a dicing lane. |