http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101086973-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68735 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6875 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C30B25-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-4583 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-205 |
| filingDate | 2009-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2011-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2011-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101086973-B1 |
| titleOfInvention | Susceptor, semiconductor manufacturing device and semiconductor manufacturing method |
| abstract | BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a susceptor, a semiconductor manufacturing apparatus, and a semiconductor manufacturing method, wherein a susceptor includes a first end for installing a wafer and a susceptor having a convex portion at a bottom of the first end, the top surface of the convex portion. In the state where the wafer is installed, a gap is formed between the top surface of the convex portion and the back surface of the wafer. |
| priorityDate | 2008-05-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6327210 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID426098976 |
Total number of triples: 17.