http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101084815-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-056 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-386 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 2008-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2011-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2011-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101084815-B1 |
| titleOfInvention | The manufacturing method of a board | substrate and the copper surface treating agent used for this |
| abstract | Provided are a method for producing a substrate capable of forming an organic film that improves adhesion on a copper or copper alloy surface, and improving adhesion between copper and resin, and a copper surface treatment agent used in the same.n n n The manufacturing method of the board | substrate of this invention is a process of contacting the process liquid containing an aminotetrazol compound, an aminotriazole compound, and an alkylamine derivative to at least one surface side of the copper or copper alloy surface, and the said process liquid. Forming a resist layer on the surface of the copper or copper alloy. The copper surface treatment agent of the present invention is a copper surface treatment agent for improving adhesion between the surface of a copper or copper alloy and a resist layer, wherein the aminotetrazole compound is 0.05 wt% or more, the aminotriazole compound 0.1 wt% or more and the alkylamine derivative 0.1 wt%-10wt%, and remainder contain water. |
| priorityDate | 2007-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 48.