| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08C19-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L15-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D163-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L9-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate |
2005-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2011-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2011-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101081619-B1 |
| titleOfInvention |
Epoxy Resin Compositions and Semiconductor Devices |
| abstract |
The epoxy resin composition for semiconductor encapsulation of the present invention, (A) crystalline epoxy resin, (B) the following formula (1) [Formula 1] (R 1 and R 2 are each independently hydrogen or an alkyl group having 1 to 4 carbon atoms, and a plurality of R 1 's or a plurality of R 2' s may be the same as or different from each other. A is an integer of 0 to 4 and b is 0 to 4 An integer, c is an integer of 0 to 3. n is an average value of 0 to 10. (C) a (co) polymer or a derivative thereof comprising a structural unit derived from butadiene, and (D) an inorganic filler contained in the total epoxy resin composition of 80% by weight or more and 95% by weight or less. |
| priorityDate |
2004-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |