| abstract |
The present invention provides a method of increasing the usable surface area of a semiconductor wafer having a substantially flat surface and a thickness perpendicular to this surface. This method comprises the steps of selecting a strip thickness for dividing a wafer into a plurality of strips, selecting a processing scheme for cutting the wafer into strips at an angle with respect to the substantially flat surface, and the selected treatment as such. Cutting the wafer into strips by separating the strips using the method, wherein the combined strip thickness and the width of the cut and removed wafer are smaller than the thickness of the wafer. n n Semiconductor, strip, slot, wafer, solar cell |