http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101078738-B1

Outgoing Links

Predicate Object
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-1089
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76846
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76874
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76831
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
filingDate 2009-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2011-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2011-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101078738-B1
titleOfInvention Copper wiring of semiconductor device and method of forming the same
abstract The present invention discloses a copper wiring of a semiconductor device and a method of forming the semiconductor device capable of completely embedding copper in the wiring formation region, even though the line width is reduced. A copper wiring of a semiconductor device according to the present invention, comprising: an interlayer insulating film formed on an upper portion of a semiconductor substrate and having a wiring formation region; A self-assembled monolayer formed on the surface of the wiring forming region; A plurality of catalyst particles adsorbed on the surface of the self-assembled monolayer; A metal film formed on the self-assembled monolayer including the catalyst particles and serving as a seed film and a diffusion barrier film; And a copper film formed to fill the wiring formation region on the metal film.
priorityDate 2009-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006246699-A1
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID9321
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425901710
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID454306093
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID702
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID454511054
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24404
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID13521
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419558793
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458397808
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419508668
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419538410
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID4311764
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23675242
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID712
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414004986
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559527
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID760
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23950
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID409092530
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559532

Total number of triples: 41.