http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101078738-B1
Outgoing Links
Predicate | Object |
---|---|
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-1089 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76846 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76874 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76831 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28 |
filingDate | 2009-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2011-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2011-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-101078738-B1 |
titleOfInvention | Copper wiring of semiconductor device and method of forming the same |
abstract | The present invention discloses a copper wiring of a semiconductor device and a method of forming the semiconductor device capable of completely embedding copper in the wiring formation region, even though the line width is reduced. A copper wiring of a semiconductor device according to the present invention, comprising: an interlayer insulating film formed on an upper portion of a semiconductor substrate and having a wiring formation region; A self-assembled monolayer formed on the surface of the wiring forming region; A plurality of catalyst particles adsorbed on the surface of the self-assembled monolayer; A metal film formed on the self-assembled monolayer including the catalyst particles and serving as a seed film and a diffusion barrier film; And a copper film formed to fill the wiring formation region on the metal film. |
priorityDate | 2009-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 41.