http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101076619-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-1352 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-0815 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K13-02 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L29-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F216-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-0861 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K13-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L23-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L29-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F216-06 |
| filingDate | 2004-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2011-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2011-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101076619-B1 |
| titleOfInvention | Resin composition and preparation method thereof |
| abstract | The present invention provides a resin composition having excellent barrier properties and excellent flexibility, secondary workability and interlayer adhesion. Moreover, it is providing the manufacturing method of the said resin composition which considered the environment which does not discharge | release carboxylic acid, such as acetic acid, to surrounding environment.n n n In the resin composition of the present invention, the content of the alkali metal salt (A) is 0.1 to 20 µmol / g in terms of alkali metal, the content of the carboxylic acid or its salt (C) is 2 µmol / g or less in terms of carboxylic acid group, and the ethylene content is 5 to It is set as EVOH resin composition (F) which is 60 mol% and saponification degree is 80-99 mol%. Moreover, it is set as the resin composition which consists of said EVOH resin composition (F) and EVOH whose ethylene content is 5-60 mol% and saponification degree is 99.2-100 mol%. n n n Barrier properties, flexibility, secondary processability, interlayer adhesion and resin composition. |
| priorityDate | 2003-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 81.