http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101076077-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1301 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2007-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2011-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2011-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101076077-B1 |
| titleOfInvention | Epoxy resin composition and semiconductor device for semiconductor encapsulation |
| abstract | (A) In the epoxy resin represented by General formula (1), the ratio of a binary nucleus (component in which n = 1 in General formula (1)) is 60% or more and 100% or less by GPC area ratio, and 2 The ratio of the bis (phenylmethyl) moiety in the nucleus to the bonding position of the glycidyl ether group in the two phenylglycidyl ethers in the para position is 35% or more relative to the entire nucleus in the NMR area ratio, 100% or less epoxy resin,n n n (B) a curing agent having two or more phenolic hydroxyl groups in one molecule,n n n (C) an inorganic filler,n n n (D) An epoxy resin composition for semiconductor encapsulation, comprising a curing accelerator and substantially free of a halogen compound and an antimony compound.n n n (In the following general formula (1), R 1 and R 2 are each an alkyl group having 1 to 4 carbon atoms, and may be the same as or different from each other. A is an integer of 0 to 3 and b is an integer of 0 to 4. n is 1) An integer of -5, where G is glycidyl) |
| priorityDate | 2006-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 105.