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filingDate 2005-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2011-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2011-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101071791-B1
titleOfInvention Paste Composition and Dielectric Composition Using the Same
abstract The present invention is a paste composition comprising an inorganic filler, a resin, and a solvent containing a solvent having a boiling point of 160 ° C. or more, the solvent having at least one solvent having a boiling point of 160 ° C. or more, and an inorganic filler having an average particle diameter of the filler of 5 μm or less, A paste composition, wherein the total amount of solvent is 25% by weight or less of the total amount of the paste composition, wherein the dielectric composition has an inorganic filler and a resin, wherein the inorganic filler has at least two kinds of average particle diameters, and the maximum average particle diameter of the average particle diameters is 0.1. It is-5 micrometers, and it is related with the dielectric composition characterized by the maximum average particle diameter three times or more with respect to a minimum average particle diameter. According to the present invention, a high dielectric constant composition having a low coefficient of linear expansion and having a large capacitance can be obtained.
priorityDate 2003-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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