http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101070834-B1

Outgoing Links

Predicate Object
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2863
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2893
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01J1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2867
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2635
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2887
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
filingDate 2009-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2011-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2011-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101070834-B1
titleOfInvention LED chip testing device and LED chip sorting device
abstract The present invention provides a loading unit for supplying the LED chip to be tested; A seating member on which the LED chip supplied from the loading unit is seated, a rotating member on which a plurality of seating members are installed, and a loading position where the LED chip supplied from the supply unit is loaded on the seating member, and a test position at which the LED chip is tested And a rotating unit for rotating the rotating member so that the mounting members are sequentially positioned at each of the unloading positions at which the LED chip is unloaded from the seating member, the supply unit being installed next to the loading unit; A test unit including a contact unit for emitting an LED chip positioned at the test position and a measuring unit measuring optical characteristics of the LED chip positioned at the test position, the test unit being installed next to the supply unit; And an unloading unit configured to unload an LED chip from the seating member positioned at the unloading position.n n n According to the present invention, it is possible to accurately measure the performance of the LED chip, thereby preventing the loss of the material cost, process cost, etc. by preventing the LED chip that is unnecessarily undergoing the packaging process and the test process, The manufacturing cost can be lowered.n n n n Optical characteristics, LED chip
priorityDate 2009-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID482532689
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23985

Total number of triples: 18.