http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101067880-B1

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d9ff9f1d995a1fbc7b5f69d8b4eec5ef
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
filingDate 2011-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2011-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_20dda0a3b1381ffd9eb11a41f4825ae1
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publicationDate 2011-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101067880-B1
titleOfInvention Semiconductor memory temperature evaluation device using thermoelectric element and near infrared heater
abstract The present invention is not only easy to use a narrow space in evaluating the temperature of the semiconductor memory, but also easy to move, thermoelectric element and near-infrared ray that can be quickly and accurately temperature evaluation by irradiating local heat only in the semiconductor memory A semiconductor memory temperature evaluation device using a heater, At least one blower fan (34, 35), the thermoelectric element unit 30 is installed, the outer case 10 having a structure with an open bottom, and installed inside the outer case 10 and the thermoelectric element unit 30 The heat sink 32 and the power supply for transferring the heat source generated from the cold sink 31 and the thermoelectric element 33 to the semiconductor memory to dissipate the thermoelectric element 33 so as to perform a function of smooth heating and cooling. At least one thermoelectric element 33 for generating a heat source at the time of supply and at least one heat sink fan 34 for indirectly heating the semiconductor memory by using convection of the heat source of the heat sink is provided. The thermoelectric element unit 30 having the cold sink heat dissipation fan 35 for discharging to the outside of the case 10 through convection, and is positioned in the lower direction of the thermoelectric element unit 30, are integral with the outer case 10. Is fixed to, one or more ventilation grooves 21 are formed A lower cover 20, a lower chamber 40 disposed in a lower direction of the lower cover 20 and fixed integrally with the outer case 10, and at least one installation fixed inside the lower chamber 20, The near-infrared heat 50 which consists of the lamp 51 and the socket 52 which are couple | bonded and fixed to the both ends of the lamp 51 so that heat may be generated by an external power supply and direct heat to a semiconductor memory is provided. It is composed of organically combined with each other.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20220120795-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20220120796-A
priorityDate 2011-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 26.