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filingDate 2003-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2011-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2011-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101064034-B1
titleOfInvention Dielectric Film Etched to Controlled Depth
abstract Dielectric films used as substrates for flexible circuits include polymers selected from the group consisting of liquid crystal polymers and polyimide copolymers comprising carboxyl ester structural units in the polymer backbone. The dielectric film includes at least one thinned recess area having a thickness reduced to less than 15 μm, requiring the use of dielectric film, for example, for ink jet printheads, hard disk drive gimbal devices, and contact sensor applications. It has a thickness of 탆 to 60 탆.n n n Substrates for flexible circuits, dielectric films, polymers, copolymers, polyimides, recess areas
priorityDate 2002-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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