| abstract |
The present invention relates to a plating apparatus used to form a plating film in trenches, via holes or resist openings formed in a surface of a semiconductor wafer, and to form bumps on a substrate of the semiconductor wafer to be electrically connected to the electrodes of the package. . The plating apparatus 170 holds the plating tank 186 holding the plating solution 188, and contacts the plating solution 188 in the plating tank 186 with the surface to be plated of the workpiece, holding the workpiece W. FIG. It has a holder 160 to make. Having a plurality of plating solution spray nozzles 222 for spraying the plating solution 188 onto the surface to be plated of the workpiece held by the holder 160 to supply the plating solution 188 into the plating tank 186. A ring-shaped nozzle pipe 22 or a stirring mechanism having a stirring blade is disposed in the plating tank 186. |