http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101055625-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-30 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate | 2009-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2011-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2011-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101055625-B1 |
| titleOfInvention | Ink composition for wiring and copper wiring formation method using the same |
| abstract | The present invention relates to a wiring ink composition comprising a copper-glycine complex of Formula 1 and a method of printing the same on a substrate and then heat-treating to form a copper wiring.n n n [Formula 1]n n n n n n n n [In Formula 1, M is Cu, and R 1 and R 2 may be different or identical to each other, and a C3-C7 linear or branched alkyl group having one or more halogens substituted.]n n n The wiring ink composition according to the present invention has an advantage of excellent dispersion stability than the ink composition in which the metal nanoparticles of the prior art are dispersed in a dispersion solvent together with a surfactant or a lid ligand. In addition, there is an advantage that the heat treatment process can be performed at a low temperature, it is suitable for the inkjet printing method can easily form the electrode wiring pattern.n n n n Wiring ink, copper compound, copper composite, inkjet printing, conductive ink, copper precursor, electrode wiring pattern, RFID |
| priorityDate | 2009-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 75.