http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101051488-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-48 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-48 |
| filingDate | 2009-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2011-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2011-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101051488-B1 |
| titleOfInvention | Method for manufacturing light emitting diode unit, and light emitting diode unit manufactured by this method |
| abstract | According to an embodiment of the present invention, an upper conductive layer having a positive electrode pattern and a negative electrode pattern is formed on an upper surface of an insulating substrate, and a thermal conductive layer for heat dissipation is formed on a lower surface of the insulating substrate. A first step of preparing an upper substrate having openings formed between the conductive layer and the upper conductive layer serving as the negative electrode pattern; A second process of preparing a lower substrate having upper and lower thermal conductive layers formed on upper and lower surfaces of the insulating substrate for heat dissipation; A third step of adhering the upper substrate and the lower substrate through an adhesive layer; A fourth step of mounting a light emitting diode chip on the adhesive layer in the opening of the upper substrate; A fifth step of wire-bonding the N-type pad and the P-type pad of the light emitting diode chip to the upper conductive layer, wherein the upper electrode conductive layer becomes a positive electrode pattern and a negative electrode pattern; A method of manufacturing a light emitting diode unit comprising a sixth step of epoxy molding an opening and a wire bonding portion of the upper substrate, and a light emitting diode unit manufactured by the method. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10043784-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9865577-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9343448-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11373986-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9214494-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9599857-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9111464-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9159700-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9029880-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9559142-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9178123-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10784236-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-2522816-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-2522816-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9620487-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014093063-A1 |
| priorityDate | 2009-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 36.