| abstract |
The adhesive composition of the present invention includes the adhesive component and the conductive particles 10 dispersed in the adhesive component, and the conductive particles 10 include the substrate particles 1 and the substrate particles 1 constituting the center portion thereof. The metal plating layer 3 which covers at least one part of the surface of (), and the some metal microparticles | fine-particles 2 arrange | positioned on the surface of the substrate particle 1 inside the metal plating layer 3 are included.n n n n Adhesive composition, conductive particles, plating layer, metal particles |