http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101045565-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 |
| filingDate | 2011-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2011-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2011-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101045565-B1 |
| titleOfInvention | Substrate for ball grid array semiconductor package and manufacturing method thereof |
| abstract | The present invention relates to a substrate for a ball grid array semiconductor package and a method of manufacturing the same. A substrate for a ball grid array semiconductor package of the present invention comprises: a substrate substrate formed of bismaramide triazine; A first electroless plating layer formed on the base substrate; And a first electroplating layer formed on the first electroless plating layer. It includes. The present invention does not require the use of an adhesive layer, can control the formation thickness of the conductive metal plating layer, and can manufacture a substrate for a ball grid array semiconductor package having excellent adhesion strength. Moreover, since the board | substrate for ball grid array semiconductor packages of this invention does not use an adhesive layer, it is excellent in heat resistance, chemical-resistance, and a migration characteristic. |
| priorityDate | 2011-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 37.