| abstract |
A plurality of semiconductor packages are manufactured collectively on a wafer in a batch process, after which the wafer is diced to obtain a separated semiconductor package. The semiconductor package is a laminate formed by bonding two or more semiconductor devices. Each semiconductor device includes a substrate and a device pattern formed on the surface of the substrate. The semiconductor device is stacked in such a manner that the device pattern surface of the lower semiconductor device faces the non-device pattern surface of the semiconductor device stacked thereon. n n Semiconductor package, device pattern surface, non-device pattern surface, semiconductor device, separated semiconductor package |