http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101045538-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0723 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0361 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12944 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-167 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-562 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-16 |
| filingDate | 2003-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2011-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2011-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101045538-B1 |
| titleOfInvention | Method for forming thin film resistive layer, conductive substrate with resistive layer and circuit board material with resistive layer |
| abstract | The present invention provides a plating bath capable of forming a resistive layer with a uniform thickness distribution on a surface of a roughened conductive substrate, a conductive substrate having a resistive layer having a stable thin film resistive layer, and a resistive circuit board material using the same. For the purpose of The present invention provides a plating bath for forming a thin film resistance layer on the surface of a conductive substrate, wherein the plating bath contains nickel ions and sulfamic acid or salts thereof as essential components, and phosphoric acid, phosphorous acid or hypophosphoric acid, and at least one of these salts. A plating bath for forming a thin film resistive layer, a conductive substrate having a resistive layer having a thin film resistive layer formed by the plating bath, and a resistive circuit board material using the same. |
| priorityDate | 2002-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 51.