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filingDate 2011-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2011-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_83f507e0fce8736f046219d3cc0e00f9
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publicationDate 2011-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101043273-B1
titleOfInvention A conductive polymer filler comprising carbon nanotube microcapsules surrounded by a thermoplastic resin layer and a method of manufacturing the same
abstract The present invention relates to a conductive polymer filler for manufacturing a conductive plastic and a method for manufacturing the same, more specifically, carbon nanotubes (CNT; carbon nanotubes including a thermoplastic resin layer surrounding the carbon nanotubes in the form of carbon A conductive polymer filler comprising nanotubes and a method of manufacturing the same. The present invention also relates to a conductive thermoplastic resin comprising the conductive polymer filler. The conductive polymer filler according to the present invention includes carbon nanotube microcapsules including carbon nanotubes and a thermoplastic resin layer surrounding the carbon nanotubes. The carbon nanotube-containing conductive polymer filler according to the present invention is well dispersed evenly in the conductive thermoplastic resin, and also solves the problem of low adhesion between the carbon nanotube and the matrix thermoplastic resin, thereby reducing the amount of carbon nanotube It is possible to exhibit excellent electrostatic characteristics even if using. Since carbon nanotubes themselves are expensive, it is obvious that they are economically advantageous if they can exhibit excellent electrostatic dispersion properties using a small amount.
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