http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101036353-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L9-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 |
| filingDate | 2009-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2011-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2011-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101036353-B1 |
| titleOfInvention | Adhesive paste for semiconductor packaging with screen printing |
| abstract | Provided is an adhesive paste composition for screen printing, which is an adhesive paste composition for manufacturing a semiconductor device, which does not require B-staging. The adhesive paste composition of the present invention comprises 10 to 25% by weight of epoxy resin, 40 to 70% by weight of inorganic filler, 5 to 15% by weight of rubber, 5 to 20% by weight of curing agent and 5 to 10% by weight of lactone plasticizer. Include. The lactone plasticizer in the composition of the present invention is a 5-7 member ring compound that can cause a ring opening reaction at a temperature of 100 ℃ ~ 150 ℃. And the weight ratio of the epoxy resin and the inorganic filler is epoxy resin: inorganic filler = 1: 2 to 1: 7, and the weight ratio of the plasticizer and the epoxy resin is in the range of epoxy resin: plasticizer = 1: 1 to 5: 1. |
| priorityDate | 2009-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 58.