http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101030556-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24893 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-10 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-322 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-24 |
| filingDate | 2008-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2011-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2011-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101030556-B1 |
| titleOfInvention | Ink for conductor pattern formation, conductor pattern and wiring board |
| abstract | The present invention is to provide a conductive pattern forming ink capable of preventing disconnection of a conductor pattern due to thermal expansion of a ceramic molded body, to provide a highly reliable conductor pattern, and to provide such a conductor pattern, thereby providing reliability. It is a problem to provide this high wiring board.n n n In order to solve this problem, the conductive pattern forming ink of the present invention is applied onto a sheet-like ceramic molded body composed of ceramic particles and a material containing a binder, and is used as a conductive pattern forming ink used for forming a conductive pattern. It contains a disconnection inhibitor composed of an aqueous dispersion medium, metal particles dispersed in the aqueous dispersion medium, and an organic substance that can follow the thermal expansion of the ceramic molded body when degreasing and sintering the ceramic molded body. It features. It is preferable that the said organic substance is a polyglycerol compound which has a polyglycerol skeleton.n n n n Polyglycerol Compound, Disconnection Inhibitor, Ink for Forming Conductor Pattern |
| priorityDate | 2007-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 110.