| abstract |
There is provided a laminate comprising a substrate to be ground and a support, wherein the substrate is ground to a very small thickness and can be separated from the support without damaging the substrate. One embodiment of the present invention is a laminate comprising a substrate to be ground, a bonding layer in contact with the substrate to be ground, a light-to-heat conversion layer comprising a light absorber and a thermally decomposable resin, and a light-transmissive support. After grinding the support surface opposite the surface in contact with the bonding layer, the laminate is irradiated through the light transmitting layer, and the light-to-heat conversion layer is decomposed to separate the light transmitting support and the substrate.n n n n Laminate, ultra-thin substrate, bonding layer, photothermal conversion layer, light absorber |