http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101015857-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0757 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0392 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-037 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0233 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0226 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-06 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039 |
| filingDate | 2008-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2011-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2011-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101015857-B1 |
| titleOfInvention | Positive photosensitive resin composition |
| abstract | The present invention relates to a positive photosensitive resin composition, wherein the positive photosensitive resin composition comprises (A) a polyamide polymer represented by the following formula (1), (B) an esterified quinonediazide compound, and (C) a phenol group-containing compound , And (D) a solvent.n n n [Formula 1]n n n n n n n n (In the above formula, the definition of each substituent is the same as defined in the specification.)n n n The positive photosensitive resin composition of this invention is excellent in heat resistance, and can form a fine pattern of high sensitivity and high resolution.n n n n Positive photosensitive composition, polyamide, semiconductor element protective film, phenolic hydroxyl group, aqueous alkali solution, terminal agent |
| priorityDate | 2008-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 162.