http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101014839-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2008-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2011-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2011-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101014839-B1 |
| titleOfInvention | Electrochemical Processing of Three-Dimensional SiP Through-Through Vias and Bumps |
| abstract | The present invention relates to an electrochemical processing method introduced for a through via process of a 3D SiP (Through Via in 3D System in packaging), and more particularly, an interlayer transfer signal used in a through via of a 3D SiP. Forming a through via as a passage, forming a metal plating layer in the via, electroplating the planarization layer by electroplating, electroless plating copper on the planarized plating layer, and Electroless plating of the tin on the plating layer, it provides a method of electrochemical processing of the through-type vias and bumps of the three-dimensional SiP. According to the present invention, it is possible to use the existing equipment by performing only different electrolyte solutions in the electroplating via filling equipment, thereby improving the process economy such as process cost and processing time, and There is an advantage in that it is possible to improve the pattern and mask alignment problem that occurs during PR (Photoregist) work in the non-uniformity and fine pitch.n n n n Through-vias of 3D SiP, electropolishing, electroless plating, copper, tin, electrolytes, pulse-reverse pulse currents, copper / tin bumps |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014051645-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9070748-B2 |
| priorityDate | 2008-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 47.